Wire Bond Process Troubleshooting Guide

Effective wire-bond troubleshooting separates material, equipment, tooling, surface, and recipe causes before parameters are changed. Visual evidence, failure modes, pull and shear results, and equipment history should be reviewed together.

Preparation

Review the product drawing, material specification, equipment capability, and acceptance criteria before starting. Confirm that measuring tools are calibrated and that the selected samples represent normal production conditions.

Key technical checks

• Check pad cleanliness, wire condition, capillary wear, calibration, and setup before adjusting the recipe.
• Evaluate bond force, ultrasonic energy, time, temperature, geometry, and failure location as interacting factors.
• Confirm corrective actions on representative units and monitor capability across tools, operators, and lots.

Verification and documentation

Record the baseline, the variables changed, inspection results, and final settings. Release the process only after repeatability is confirmed against the agreed criteria. Keep the qualified settings, maintenance requirements, and response plan available to operators so that future deviations can be identified and corrected quickly.