Probe-card cleaning frequency should be based on contact resistance, touchdown count, pad metallurgy, debris accumulation, and retest trends rather than a fixed universal interval. Cleaning too late increases false failures, while excessive cleaning can shorten probe life.
Learn more →Plasma treatment improves adhesion by removing trace contamination and increasing surface energy through controlled activation. Better wetting allows adhesives, coatings, and encapsulants to spread more evenly and form stronger interfaces.
Learn more →Plasma cleaning is recommended when organic residue, weak boundary layers, or poor surface wettability may affect bonding, coating, molding, or adhesion. It is commonly used before die attach, wire bonding, underfill, encapsulation, and other critical assembly steps.
Learn more →Dicing blades are precision tools and should be protected from impact, bending, moisture, dust, and chemical contamination. Correct storage and handling preserve blade geometry and reduce unexpected breakage during setup.
Learn more →Premature blade wear is usually caused by an unsuitable blade specification, excessive feed load, poor cooling, incorrect dressing, spindle vibration, or contamination at the flange. Wear should be evaluated together with cut quality and spindle load.
Learn more →Wafer dicing chipping can be reduced by matching the blade, spindle speed, feed rate, cut depth, coolant flow, and mounting method to the wafer material and thickness. Both front-side and backside chipping should be measured because they can have different root causes.
Learn more →A process window defines combinations of settings that consistently meet visual, dimensional, and mechanical requirements. Designed experiments and capability data make the window repeatable across lots and tools.
Learn more →Pull and shear strength reflect bond formation, wire properties, geometry, and failure mode. Improvement requires interpreting where the sample fails, not simply increasing the measured force.
Learn more →Non-stick-on-pad defects can result from contamination, oxidation, poor capillary condition, weak ultrasonic transfer, pad damage, or incorrect setup. Structured checks prevent random parameter changes.
Learn more →Bond force, ultrasonic energy, time, temperature, tool condition, and material quality interact to form the bond. A robust recipe creates adequate deformation and intermetallic contact without pad damage.
Learn more →著作権 © 2026 スーザン・ノワ・セミコンダクター株式会社。無断転載を禁じます。.
