技術サポート

Reducing Non-Stick-on-Pad Defects

Non-stick-on-pad defects can result from contamination, oxidation, poor capillary condition, weak ultrasonic transfer, pad damage, or incorrect setup. Structured checks prevent random parameter changes.

Learn more →

Key Wire Bonding Process Parameters

Bond force, ultrasonic energy, time, temperature, tool condition, and material quality interact to form the bond. A robust recipe creates adequate deformation and intermetallic contact without pad damage.

Learn more →

Choosing Bonding Wire Materials

Gold, copper, silver, and aluminum wires differ in conductivity, hardness, oxidation behavior, cost, and process requirements. Diameter, coating, pad finish, and package environment also affect selection.

Learn more →

Ball Bonding and Wedge Bonding Compared

Ball bonding is fast and commonly uses gold or copper wire, while wedge bonding supports aluminum wire, lower loop profiles, and directional geometries. Product design and materials determine the best method.

Learn more →

Selecting Lead-Free Solder Alloys

SAC alloys are widely used, while low-silver, bismuth-containing, tin-copper, and specialty alloys address cost or temperature needs. Selection should consider reliability, melting range, finish compatibility, and rework.

Learn more →

部品、機器、またはエンジニアリングソリューションをお探しですか?

弊社エンジニアにお問い合わせください。ご使用の機器のモデル、部品番号、またはプロセス要件をお知らせください。
チームはあなたに適切なソリューションを見つけるお手伝いをいたします。

著作権 © 2026 スーザン・ノワ・セミコンダクター株式会社。無断転載を禁じます。.