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Automatic BG Taping

Automatic BG Taping

  • Automated protective tape application before backgrinding
  • Controlled lamination supports uniform wafer coverage
  • Helps reduce bubbles, wrinkles and handling variation
  • Recipe-based operation for repeatable production
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Product Introduction

Automatic BG taping equipment applies protective tape to the wafer surface before backgrinding. Controlled lamination helps shield the device side and maintain uniform adhesion throughout the process.

Automated handling reduces manual variation and supports repeatable tape placement. The system can be configured for different wafer sizes, tape materials and production recipes.

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