EN CN

顶针

Precision tip geometry supports controlled die release
Wear-resistant construction for repeated production cycles
Smooth motion helps reduce stress on delicate dies
Available in custom diameters, lengths and tip profiles

产品介绍

Ejector pins assist die separation from adhesive tape during semiconductor pick-up. Controlled pin movement and accurate tip geometry help lift the die for reliable nozzle engagement.

Pins can be selected for different die sizes, tape conditions and ejector systems. Proper material and surface finish support repeatable motion and help reduce damage risk.

客户与销售咨询

sales@nowasemi.com

寻找零件、设备或工程解决方案？

请告知您的设备型号、零件编号或工艺需求，
我们的工程团队将协助您找到合适的解决方案。

提交咨询

顶针

产品介绍

相关产品

客户与销售咨询

寻找零件、设备或工程解决方案？