{"id":1194,"date":"2026-10-15T14:21:03","date_gmt":"2026-10-15T06:21:03","guid":{"rendered":"http:\/\/nowa1008.web.site808.cn\/?post_type=product&#038;p=1194"},"modified":"2026-10-15T15:00:25","modified_gmt":"2026-10-15T07:00:25","slug":"uv-tapes","status":"publish","type":"product","link":"https:\/\/www.nowasemi.com\/zh\/product\/uv-tapes\/","title":{"rendered":"UV \u80f6\u5e26"},"content":{"rendered":"<div class=\"showpro_two pb95\">\n<div class=\"container\">\n<div class=\"all_title ta\">\n<h3>\u4ea7\u54c1\u4ecb\u7ecd<\/h3>\n<p><i><\/i><\/div>\n<div class=\"content mt25\">\n<p>UV tapes provide temporary wafer support during backgrinding, dicing and related semiconductor processes. Before UV exposure, the adhesive holds the wafer securely to support stable processing.<\/p>\n<p>After controlled UV irradiation, adhesion is reduced to simplify die pick-up or wafer release. Tape selection should consider wafer surface, process temperature and required holding strength.<\/p>\n<\/div>\n<\/div>\n<\/div>","protected":false},"featured_media":1175,"template":"","meta":{"_acf_changed":false},"product_cat":[52],"class_list":["post-1194","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-sawing-grinding"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/product\/1194","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/media\/1175"}],"wp:attachment":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/media?parent=1194"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/product_cat?post=1194"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}