{"id":1293,"date":"2026-10-16T09:12:28","date_gmt":"2026-10-16T01:12:28","guid":{"rendered":"http:\/\/nowa1008.web.site808.cn\/?post_type=support&#038;p=1293"},"modified":"2026-10-16T09:15:38","modified_gmt":"2026-10-16T01:15:38","slug":"improving-contact-stability-during-wafer-test","status":"publish","type":"support","link":"https:\/\/www.nowasemi.com\/zh\/support\/improving-contact-stability-during-wafer-test\/","title":{"rendered":"Improving Contact Stability During Wafer Test"},"content":{"rendered":"<h2>Improving Contact Stability During Wafer Test<\/h2>\n<p>Stable contact requires clean probe tips, correct overdrive, accurate planarity, controlled force, and repeatable wafer positioning. Trend data can reveal degradation before it becomes a yield event.<\/p>\n<h3 class=\"mt30\">\u5173\u952e\u8003\u8651\u56e0\u7d20<\/h3>\n<ul>\n<li>\u5728\u52a0\u5de5\u524d\u786e\u8ba4\u6750\u6599\u517c\u5bb9\u6027\u3001\u8bbe\u5907\u72b6\u51b5\u548c\u9a8c\u6536\u6807\u51c6\u3002.<\/li>\n<li>\u63a7\u5236\u5173\u952e\u53c2\u6570\uff0c\u5e76\u8bb0\u5f55\u6bcf\u6279\u5408\u683c\u4ea7\u54c1\u6216\u751f\u4ea7\u6279\u6b21\u7684\u53ef\u8ffd\u6eaf\u6570\u636e\u3002.<\/li>\n<li>\u5229\u7528\u68c0\u6d4b\u548c\u6027\u80fd\u7ed3\u679c\uff0c\u533a\u5206\u6b63\u5e38\u53d8\u5316\u4e0e\u6b63\u5728\u53d1\u751f\u7684\u5de5\u827a\u95ee\u9898\u3002.<\/li>\n<\/ul>\n<h3 class=\"mt30\">\u63a8\u8350\u7684\u65b9\u6cd5<\/h3>\n<p>\u4ece\u5df2\u8bb0\u5f55\u7684\u57fa\u7840\u6570\u636e\u5f00\u59cb\uff0c\u5e76\u4e00\u6b21\u6027\u6539\u53d8\u4e00\u4e2a\u660e\u786e\u7684\u56e0\u7d20\u3002\u8fd0\u884c\u4ee3\u8868\u6027\u6837\u672c\uff0c\u4e0e\u534f\u8bae\u89c4\u8303\u8fdb\u884c\u5bf9\u6bd4\uff0c\u5e76\u9a8c\u8bc1\u6539\u8fdb\u7ed3\u679c\u662f\u5426\u5728\u4e0d\u540c\u5730\u70b9\u3001\u64cd\u4f5c\u5458\u548c\u7269\u6599\u6279\u6b21\u4e2d\u4fdd\u6301\u7a33\u5b9a\u3002\u9884\u9632\u6027\u7ef4\u62a4\u548c\u5b9a\u671f\u6821\u51c6\u5e94\u8be5\u652f\u6301\u8fd9\u4e00\u8fc7\u7a0b\uff0c\u800c\u4e0d\u662f\u5f25\u8865\u4e0d\u7a33\u5b9a\u914d\u65b9\u7684\u4e0d\u8db3\u3002.<\/p>\n<h3 class=\"mt30\">\u7ed3\u8bba<\/h3>\n<p>Improving Contact Stability During Wafer Test should be managed through clear specifications, controlled trials, and ongoing trend review. This approach improves repeatability, supports faster troubleshooting, and reduces the risk of hidden reliability issues in semiconductor manufacturing.<\/p>","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":false},"support_cat":[74],"class_list":["post-1293","support","type-support","status-publish","hentry","support_cat-wafer-probe-testing-basics"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/support\/1293","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/support"}],"about":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/types\/support"}],"wp:attachment":[{"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/media?parent=1293"}],"wp:term":[{"taxonomy":"support_cat","embeddable":true,"href":"https:\/\/www.nowasemi.com\/zh\/wp-json\/wp\/v2\/support_cat?post=1293"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}