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ディシングブレード

Fine cutting edge supports narrow and controlled kerfs
Stable blade structure for repeatable dicing
Suitable for brittle and hard material processing
Multiple blade formats available for varied applications

Product Introduction

Dicing blades are precision cutting tools used to separate wafers, substrates and other brittle materials into individual components. Their cutting edge is designed to deliver controlled kerf width and consistent cut quality.

Blade construction can be selected according to the workpiece material, spindle system and process target. Correct matching helps balance cutting accuracy, blade life and production efficiency.