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UVテープ

Secure wafer support during processing and transport
UV-responsive adhesion enables easier release after exposure
Helps reduce wafer movement during dicing
Available for different wafer and process requirements

Product Introduction

UV tapes provide temporary wafer support during backgrinding, dicing and related semiconductor processes. Before UV exposure, the adhesive holds the wafer securely to support stable processing.

After controlled UV irradiation, adhesion is reduced to simplify die pick-up or wafer release. Tape selection should consider wafer surface, process temperature and required holding strength.