Dicing Blades

Pisau pengisar

  • Fine cutting edge supports narrow and controlled kerfs
  • Stable blade structure for repeatable dicing
  • Suitable for brittle and hard material processing
  • Multiple blade formats available for varied applications
Get a quote

Product Introduction

Dicing blades are precision cutting tools used to separate wafers, substrates and other brittle materials into individual components. Their cutting edge is designed to deliver controlled kerf width and consistent cut quality.

Blade construction can be selected according to the workpiece material, spindle system and process target. Correct matching helps balance cutting accuracy, blade life and production efficiency.

Related Products

Customer and Sales Consulting

    Ingin mencari bahagian, peralatan atau penyelesaian kejuruteraan?

    Beritahu kami model peralatan anda, nombor bahagian atau keperluan proses. Jurutera kami
    Pasukan kami akan membantu anda mencari penyelesaian yang tepat.

    Hakcipta © 2026 Suzhou NOWA Semiconductor Co., Ltd. Hak cipta terpelihara.