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Precision dimensions support stable compound transfer
Wear-resistant material for repeated molding cycles
Controlled surface finish promotes reliable sealing and motion
Custom sizes available for specific mold systems

产品介绍

Mold plungers transfer molding compound into the cavity system during semiconductor encapsulation. Precision dimensions and surface finish help maintain stable pressure and smooth operation.

They are produced for repeated use under molding temperature and load. Material, coating and geometry can be selected according to the mold design and maintenance requirements.

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