Ceramic capillaries are precision bonding tools used to guide wire and form reliable interconnections during semiconductor packaging. Their controlled geometry supports accurate wire placement and repeatable bond formation.
The ceramic construction provides wear resistance and dimensional stability for continuous production. Different tip profiles and dimensions can be selected to suit the wire material, package design and bonding process.
The specifications below cover representative ceramic capillary series. Final dimensions can be customized to the bonding wire, package design and process requirements.
| Series | Part Number | Application | Wire | Key Dimensions | Surface / Material | Tested Lifetime |
|---|---|---|---|---|---|---|
| R3 High-Performance | BAN-080-2535-CR301 | SSOP024L | 0.8 mil PdCu | BPO/BPP: 55×55/70 μm | R3 ceramic | Up to 2.2M cycles |
| Threaded Surface | Custom | QFN | 0.8 mil PdCu | BPO/BPP: 48×48/60 μm | Threaded tip surface | Up to 2.5M cycles |
| R5 High-Performance | BAN-060-2226-CR502 | BGA | 0.7 mil PdCu | BPO/BPP: 41/50 μm | R5 ceramic | Up to 3M cycles |
| Coated Capillary | SBC-100-2228-BR301 | LED | 0.7 mil Cu | Electrode: 50 μm | Grid + coating | Up to 2.5M cycles |
Available geometry includes OD, tip diameter, CD, H, CA, FA, BPO/BPP, neck height and neck angle. Capillary length is available from 9–20 mm, with single deep cutting, annular deep cutting and bilateral deep cutting options. Other dimensions and surface treatments are supplied according to the customer’s application requirements.
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