Packaging reliability depends on stable materials, controlled assembly, and verification under realistic stresses. Typical evaluations include temperature cycling, humidity exposure, mechanical tests, and electrical monitoring.
Learn more →Mold compounds, die-attach materials, substrates, leadframes, bonding wires, and underfills work as one material system. Their thermal expansion, moisture behavior, adhesion, and cleanliness strongly influence reliability.
Learn more →Package selection affects board area, signal integrity, heat dissipation, manufacturability, and inspection. Common choices include leaded packages, QFN, BGA, wafer-level packages, and advanced multi-die modules.
Learn more →Semiconductor packaging protects the die, creates electrical connections, removes heat, and provides a practical form for assembly. A sound package design balances electrical, thermal, mechanical, and cost requirements from the start.
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