Extending Probe Card Service Life
Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.
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Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.
Learn more →Alignment and planarity determine whether probes contact the intended pad locations with balanced force. Optical inspection, scrub-mark review, and metrology help identify bent, worn, or shifted probes.
Learn more →Probe tips collect oxide, metal transfer, and organic residue during testing. Cleaning method, media, force, frequency, and validation must match the probe technology and pad metallurgy.
Learn more →Stable contact requires clean probe tips, correct overdrive, accurate planarity, controlled force, and repeatable wafer positioning. Trend data can reveal degradation before it becomes a yield event.
Learn more →Intermittent contact, excessive resistance, pad damage, alignment drift, and temperature instability can create false results. Troubleshooting should separate probe-card, prober, tester, wafer, and recipe causes.
Learn more →A typical flow includes wafer alignment, touchdown, parametric and functional tests, binning, map review, and data transfer. Yield, contact resistance, retest rate, throughput, and false-fail rate are key metrics.
Learn more →Wafer probe testing makes temporary electrical contact to each die before packaging. It screens defects early, supports wafer maps, and provides data for process control and final-test planning.
Learn more →Preventive maintenance protects electrical accuracy and reduces unplanned test stops. A useful program combines inspection, cleaning, verification, usage tracking, and defined service limits.
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