Stable contact requires clean probe tips, correct overdrive, accurate planarity, controlled force, and repeatable wafer positioning. Trend data can reveal degradation before it becomes a yield event.
Learn more →Intermittent contact, excessive resistance, pad damage, alignment drift, and temperature instability can create false results. Troubleshooting should separate probe-card, prober, tester, wafer, and recipe causes.
Learn more →A typical flow includes wafer alignment, touchdown, parametric and functional tests, binning, map review, and data transfer. Yield, contact resistance, retest rate, throughput, and false-fail rate are key metrics.
Learn more →Wafer probe testing makes temporary electrical contact to each die before packaging. It screens defects early, supports wafer maps, and provides data for process control and final-test planning.
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