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自动晶圆 UV 照射机

Controlled UV exposure for consistent tape release
Automated wafer handling reduces manual contact
Recipe settings support repeatable irradiation conditions
Designed for integration after dicing or grinding processes

产品介绍

An automatic wafer UV irradiator exposes UV-sensitive tape to controlled ultraviolet energy, reducing adhesion before die pick-up or wafer release. Consistent exposure supports predictable tape performance.

Automated handling and recipe control improve repeatability across production lots. The system can be configured for different wafer sizes, tape types and required exposure conditions.