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Fully Automatic Wafer Laminator

Automated tape application for stable wafer coverage
Controlled tension and pressure support uniform lamination
Recipe-based operation improves process repeatability
Designed for integration with wafer handling workflows

Product Introduction

A fully automatic wafer laminator applies protective or process tape to wafers with controlled pressure, tension and alignment. Automation supports uniform coverage and reduces operator-dependent variation.

The system can be configured for different wafer sizes and tape types, with recipe-based controls supporting repeatable production. It is suited to backgrinding, dicing and related wafer preparation processes.