The product return and quality feedback procedure ensures that concerns are documented, traceable, and evaluated efficiently. Customers should contact the service team before returning material so that the required information and shipping instructions can be confirmed.
Learn more →Structured troubleshooting identifies the most likely cause of a process or product issue and verifies an effective corrective action. The review separates material, machine, method, environment, and handling factors using available evidence.
Learn more →Application consultation helps customers select suitable products and establish practical process conditions before production. The service can support product matching, trial planning, parameter review, and evaluation of cut quality or process performance.
Learn more →A complete technical support request helps the service team understand the application, reproduce the issue, and recommend the right next step. Provide clear product identification, process conditions, observations, and the assistance required.
Learn more →Effective wire-bond troubleshooting separates material, equipment, tooling, surface, and recipe causes before parameters are changed. Visual evidence, failure modes, pull and shear results, and equipment history should be reviewed together.
Learn more →Routine probe-card inspection helps prevent unstable contact resistance, false test failures, pad damage, and unexpected downtime. Maintenance should combine visual inspection, electrical trends, cleaning records, planarity checks, and touchdown history.
Learn more →A plasma process should be qualified as a complete system that includes gas chemistry, power, pressure, flow, treatment time, chamber condition, fixture design, and product loading. The target may be cleaning, activation, etching, or a combination of these effects.
Learn more →Selecting a dicing blade requires matching the abrasive size, bond type, blade thickness, exposure, and geometry to the workpiece material, thickness, street width, and required edge quality. A qualified setup also considers spindle capability, feed rate, cut depth, mounting method, and coolant delivery.
Learn more →Lead-free soldering defects can be prevented by coordinating pad design, component finish, solder paste, stencil printing, placement, reflow profile, and board cleanliness. Higher process temperatures make thermal control and material compatibility especially important.
Learn more →Wire bond quality is strongly affected by bond force, ultrasonic energy, bonding time, temperature, capillary condition, wire properties, and pad cleanliness. These factors interact, so stable results require a qualified process window.
Learn more →Copyright © 2026 Suzhou NOWA Semiconductor Co., Ltd. All Rights Reserved.
