Choosing Bonding Wire Materials
Gold, copper, silver, and aluminum wires differ in conductivity, hardness, oxidation behavior, cost, and process requirements. Diameter, coating, pad finish, and package environment also affect selection.
Learn more →
Gold, copper, silver, and aluminum wires differ in conductivity, hardness, oxidation behavior, cost, and process requirements. Diameter, coating, pad finish, and package environment also affect selection.
Learn more →Ball bonding is fast and commonly uses gold or copper wire, while wedge bonding supports aluminum wire, lower loop profiles, and directional geometries. Product design and materials determine the best method.
Learn more →Bridging, insufficient wetting, solder balls, tombstoning, voids, and head-in-pillow defects often arise from interacting design, material, printing, placement, and thermal factors.
Learn more →A reflow profile should activate flux, limit thermal shock, create complete wetting, and avoid excessive intermetallic growth. Preheat, soak, time above liquidus, peak temperature, and cooling rate all matter.
Learn more →SAC alloys are widely used, while low-silver, bismuth-containing, tin-copper, and specialty alloys address cost or temperature needs. Selection should consider reliability, melting range, finish compatibility, and rework.
Learn more →Production reliability improves through compatible finishes, controlled paste printing, stable reflow, suitable joint geometry, cleanliness, and feedback from inspection and reliability data.
Learn more →Thermal cycling accelerates fatigue caused by repeated expansion and contraction. Test range, dwell time, ramp rate, sample design, monitoring, and failure criteria must represent the application.
Learn more →Cracks may result from thermal-expansion mismatch, brittle intermetallic layers, voiding, vibration, board flexure, or handling. Fracture location and morphology help identify the dominant cause.
Learn more →Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.
Learn more →Alignment and planarity determine whether probes contact the intended pad locations with balanced force. Optical inspection, scrub-mark review, and metrology help identify bent, worn, or shifted probes.
Learn more →Copyright © 2026 Suzhou NOWA Semiconductor Co., Ltd. All Rights Reserved.