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Trim & Form Tooling

Precision cutting and forming for semiconductor leadframes
Controlled geometry supports consistent lead shape
Wear-resistant construction for repeated production cycles
Custom designs available for package and press requirements

Product Introduction

Trim and form tooling removes excess leadframe material and shapes package leads after molding. Precision cutting and forming surfaces support accurate, repeatable package geometry.

Tool design can be matched to the package outline, material and production press. Proper maintenance and alignment help preserve lead quality and extend tooling service life.