When Is Plasma Cleaning Recommended?

Plasma cleaning is recommended when organic residue, weak boundary layers, or poor surface wettability may affect bonding, coating, molding, or adhesion. It is commonly used before die attach, wire bonding, underfill, encapsulation, and other critical assembly steps.

Key checks

• Identify the contamination and confirm that plasma chemistry is compatible with the substrate.
• Qualify power, pressure, gas flow, and treatment time using representative samples.
• Control the delay between treatment and the next process because activation can decay.

Recommended action

Start with the approved equipment setup and process specification, then change one factor at a time using representative samples. Record the results, confirm that the improvement is repeatable, and update the operating standard only after the acceptance criteria are met.

Need further assistance?

Provide the material, equipment model, current process settings, defect images, and inspection results when requesting technical support. This information helps the support team identify the likely cause and recommend an efficient verification plan.