防止常见的无铅焊接缺陷
桥接、润湿不足、焊点球、墓石现象、空隙以及枕头内头缺陷往往源于设计、材料、印刷、放置和热因素之间的相互作用。.
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桥接、润湿不足、焊点球、墓石现象、空隙以及枕头内头缺陷往往源于设计、材料、印刷、放置和热因素之间的相互作用。.
了解更多 →流向型工艺应能够激活流化剂，限制热冲击，实现完全的润湿，并避免过度的金属间结晶生长。预热、浸泡、在液相以上的时间、峰值温度以及冷却速率都至关重要。.
了解更多 →SAC 合金的应用范围很广，而低银、含铋的锡铜合金以及特种合金则针对成本或温度要求而设计。在选择时应考虑可靠性、熔化范围、与表面处理的兼容性以及返工问题。.
了解更多 →通过兼容的表面处理、控制的粘贴打印、稳定的重新粘合、合适的接缝几何结构、清洁度以及来自检测和可靠性数据的反馈，生产可靠性得以提升。.
了解更多 →Thermal cycling accelerates fatigue caused by repeated expansion and contraction. Test range, dwell time, ramp rate, sample design, monitoring, and failure criteria must represent the application.
了解更多 →Cracks may result from thermal-expansion mismatch, brittle intermetallic layers, voiding, vibration, board flexure, or handling. Fracture location and morphology help identify the dominant cause.
了解更多 →A solder joint provides electrical, thermal, and mechanical connection throughout product life. Reliability depends on alloy, intermetallic growth, geometry, pad design, assembly conditions, and service stress.
了解更多 →Lead-free assembly uses higher process temperatures and different alloy behavior than traditional tin-lead soldering. Materials, component ratings, finishes, fluxes, and process limits must be reviewed as a complete system.
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