Extending Probe Card Service Life
Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.
Learn more →
Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.
Learn more →Alignment and planarity determine whether probes contact the intended pad locations with balanced force. Optical inspection, scrub-mark review, and metrology help identify bent, worn, or shifted probes.
Learn more →Probe tips collect oxide, metal transfer, and organic residue during testing. Cleaning method, media, force, frequency, and validation must match the probe technology and pad metallurgy.
Learn more →Stable contact requires clean probe tips, correct overdrive, accurate planarity, controlled force, and repeatable wafer positioning. Trend data can reveal degradation before it becomes a yield event.
Learn more →Intermittent contact, excessive resistance, pad damage, alignment drift, and temperature instability can create false results. Troubleshooting should separate probe-card, prober, tester, wafer, and recipe causes.
Learn more →A typical flow includes wafer alignment, touchdown, parametric and functional tests, binning, map review, and data transfer. Yield, contact resistance, retest rate, throughput, and false-fail rate are key metrics.
Learn more →Wafer probe testing makes temporary electrical contact to each die before packaging. It screens defects early, supports wafer maps, and provides data for process control and final-test planning.
Learn more →Preventive maintenance protects electrical accuracy and reduces unplanned test stops. A useful program combines inspection, cleaning, verification, usage tracking, and defined service limits.
Learn more →Copyright © 2026 Suzhou NOWA Semiconductor Co., Ltd. Tous droits réservés.