Bond force, ultrasonic energy, time, temperature, tool condition, and material quality interact to form the bond. A robust recipe creates adequate deformation and intermetallic contact without pad damage.
Learn more →Gold, copper, silver, and aluminum wires differ in conductivity, hardness, oxidation behavior, cost, and process requirements. Diameter, coating, pad finish, and package environment also affect selection.
Learn more →Ball bonding is fast and commonly uses gold or copper wire, while wedge bonding supports aluminum wire, lower loop profiles, and directional geometries. Product design and materials determine the best method.
Learn more →Wire bonding connects semiconductor pads to package leads or substrates using fine wire and controlled mechanical, ultrasonic, and thermal energy. It remains a high-volume interconnect method because it is flexible and mature.
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