技术支持

Causes of Solder Joint Cracking

Cracks may result from thermal-expansion mismatch, brittle intermetallic layers, voiding, vibration, board flexure, or handling. Fracture location and morphology help identify the dominant cause.

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Extending Probe Card Service Life

Service life improves when touchdown force, overdrive, cleaning frequency, storage, handling, and transport are controlled. Maintenance decisions should be based on condition and performance trends.

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Probe Tip Cleaning Methods

Probe tips collect oxide, metal transfer, and organic residue during testing. Cleaning method, media, force, frequency, and validation must match the probe technology and pad metallurgy.

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Probe Test Workflow and Key Metrics

A typical flow includes wafer alignment, touchdown, parametric and functional tests, binning, map review, and data transfer. Yield, contact resistance, retest rate, throughput, and false-fail rate are key metrics.

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